EPOXY RESIN POTTING COMPOUND 4 LARGE THICK POURS CAST HIGH THERMAL CONDUCTIVITY

Description

MAX EPC A/B
Electronic Potting Compound
Slow Setting Epoxy Resin For Large Casting, Potting, Encapsulating
40 Fluid Ounces Combined Volume
32 Fluid Ounces Of Resin
8 Fluid Ounce Of Curing Agent
(Larger 80-FL.Ounce Kit Size Available
https://www.ebay.com/itm/223502102334
)
4:1 Mix Ratio By Weight
Due To Considerable Difference In Density Between Resin (PART A) And Curing Agent (PART B),
Each Component Must Be Weighed To Ensure Proper Cure.
PRODUCT DESCRIPTION
MAX EPC A/B is room temperature cured epoxy-based electronic potting compound designed for large mass encapsulation of printed circuit boards.
It produces low exothermic heat suitable for large mass or thick cross-sections potting and casting application.
Upon cure, MAX EPC creates a permanent barrier against ambient air, corrosive environments, moisture and direct physical contact with the circuitry.
MAX EPC demonstrates excellent dimensional stability with minimal thermal expansion and contraction.
MAX EPC can be poured up to 4-inch thick sections and will not generate high exothermic heat during cure.
It cures very hard after 36 hours at 25°C (77°F) or can be heat cured for faster cure times.
MAX EPC A/B offers high thermal conductivity that dissipates heat away from the circuitry, preventing 'hot spots' that can cause component failure or reduced life span of the encapsulated electronic circuit.
MAX EPC A/B bonds to metals, FRP, ABS, PVC, Plastisol, and other substrates commonly used in wire jackets, circuit boards and electrical enclosures.
MAX EPC A/B yields low shrinkage and excellent dimensional stability that prevents 'component pull-outs' caused by expansion and contraction coefficients when exposed to varying temperatures. Its service temperature ranges from -40°C to 100°C (-40°F to 212°F).
MAX EPC A/B is mixed 4:1 by weight; it provides a 90-minute working time for volumes of 4 cubic inches and up to 45 minutes for larger mass -6 cubic inches. Its mixed viscosity is 2100 cPs at 25°C, similar to the consistency of corn syrup or honey and easily poured in place.
It is self-leveling and designed to release air bubbles and cure with minimal voids and porosity.
Upon cure, MAX EPC A/B permanently encapsulates the circuitry in an electrically non-conductive resin matrix that prevents any direct contact with the electronics. It is entirely waterproof and is suitable for continuous water immersion or ground buried potting applications.
RoHS Compliant
Conflict-Free Minerals
Click Play To View Video Demonstration
EPOXY POTTING COMPOUND POURING LARGE VOLUMES - MAX EPC A/B - YouTube
Click Play To View Video Demonstration
How To Mix Epoxy Resin For Food Contact Coating. Avoid Tacky Spots, Minimize Air Bubble When Mixing - YouTube
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For Encapsulating Electronic Parts And Circuit Boards
Prepare the circuit board to be potted. The circuit board should be clean and solder flux is removed to ensure a good bond.
Use spray flux remover to clean the printed circuit board before embedding in the MAX EPC A/B. Allow to dry thoroughly.
Pre arrange the wire leads to the desired position and secure.
Premix the contents of the MAX EPC Part A to redisperse any settling of the dense filler.
In a clean mixing container, weigh the PART A and Part B at a 4:1 mix ratio.
This digital scale is available for purchase with this product.
Please Click The Link To Add To Your Purchase.
Shipping cost of the scale is free. Shipping overpayments will be refunded back to the purchase account
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Mix carefully to minimize air entrapment for 3 to 5 minutes or until the components are well blended to a uniform consistency.
Pay close attention to the bottom and edges of the container and ensure it is well mixed.
Poor and inadequate mixing will cause uncured or tacky spots to appear.
Pour the mixture into another clean container and mix for another minute.
This will ensure a thoroughly mixed resin is achieved and ensure a full cure.
Pour the mixed MAX EPC into the component housing to be encapsulated ensuring complete and level coverage.
Dispense only from one corner of the component casing and allow the material to completely flow and fill the casing and encapsulate the circuit.
View the video demonstration link below. This technique will reduce voids and air entrapment.
GENERAL CURING
Allow to cure at room temperature between 20°C to 30°C for 24 to 36 hours.
MAX EPC may take longer to react at lower cure temperature.
See the table below for accelerated curing schedule.
If available, use a Durometer to determine the cured hardness; a reading of 65 D will be sufficient for handling.
To check handling properties attempt to indent the casting with using your fingernail, if it does not indent then it can be handled.
PHYSICAL PROPERTIES
Viscosity PART A -Resin
8,000-8,200 cPs at
25 °C
Viscosity PART B –Curing Agent
180-250 cPs  at
25 °C
Density PART A -Resin
1.57 Grams
Per Cubic Centimeter
Density PART B –Curing Agent
0.95 Grams
Per Cubic Centimeter
Mix Ratio By Weight
100 Parts A to 25 Parts B (4:1) By Weight
Mixed Viscosity
3,850 to 4,100 cPs at
25 °C
Mixed Color
Opaque Black
Mixed Density
2.10 g/cc
Working Time
120 Minutes (500-Gram Mass)
Peak Exotherm
90°C
Max (500-Gram Mass)
Cure Schedule
8 Hours Dry To The Touch @
25°C
96 Hours Full Cure Time At 25°C
Accelerated Cure
Allow To Cure For 3 Hours @ 25°C
Then Post Cure at
120°C
for 2 Hours
MECHANICAL PROPERTIES
Shore Durometer Hardness
85 Shore D
Dimensional Shrinkage
Less Than 0.20 % Upon Full Cure
Compressive Strength
13,800 psi
Tensile Strength
9,900 psi
Tensile Elongation
4% Maximum
Thermal Conductivity
2.36- 2.5 W/mK
Maximum Operating Temperature
110°C
ELECTRICAL PROPERTIES
Volume Resistivity
4.7 X 10
15
Ohms-Cm
Dielectric Strength-60 Cycles
500 Volts/Mil
Dielectric Constant
4.0 (10 kHz)
Dissipation Factor
.014 (10 kHz)
PLEASE CHECK OUT OTHER AVAILABLE
RESIN SYSTEMS AT OUR eBay STORE
For our complete listing, please
Visit our eBay store!
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DON'T FORGET OUR EPOXY MIXING KIT
Click The Link To Add To Order
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EVERYTHING YOU NEED TO MEASURE, MIX, DISPENSE OR APPLY
Proportioning the correct amount is equally as important to attain the intended cured properties of the resin system.
T
he container in which the epoxy and curing agent is mixed is an important consideration when mixing an epoxy resin system.
The container must withstand the tenacity of the chemical and must be free of contamination.
Most epoxy curing agent has a degree of corrosivity, as a general practice, protective gloves should be worn when handling chemicals of the same nature.
MIXING KIT CONTENTS
1 Each Digital Scale -Durable, Accurate Up To 2000.0 Grams
4 Each 32-ounce (1 Quart) Clear HDPE Plastic Mix Cups
4 Each 16-ounce (1 Pint) Clear HDPE Plastic Mix Cups
One Size Fits All Powder-Free Latex Gloves
2 Each Graduated Syringes
Wooden Stir Sticks
Assorted Size Foam Brush
IMPORTANT NOTICE
Your purchase constitutes the acceptance of this disclaimer. Please review before purchasing this product.
The user should thoroughly test any proposed use of this product and independently conclude the satisfactory performance in the application.
Likewise, if the manner in which this product is used requires government approval or clearance, the user must obtain said approval.
The information contained herein is based on data believed to be accurate at the time of publication.
Data and parameters cited have been obtained through published information, PolymerProducts and  Polymer Composites Inc. laboratories using materials under controlled conditions. Data of this type should not be used for a specification for fabrication and design. It is the user's responsibility to determine this product's fitness for use.
There is no warranty of merchantability for fitness of use, nor any other express implied warranty. The user's exclusive remedy and the manufacturer's liability are limited to refund of the purchase price or replacement of the product within the agreed warranty period. PolymerProducts and its direct representative will not be liable for incidental or consequential damages of any kind. Determination of the suitability of any kind of information or product for the use contemplated by the user, the manner of that use and whether there is any infringement of patents is the sole liability of the user.